REFERENCE
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Project name:   i058A-H1 "CAP-NET dual axis Summit Designer example"
Board name: 	i058A-H1-1.0 "Capitan NET dual axis interface board"


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 I M P O R T A N T:
 THIS BOARD ASSEMBLY MUST BE LEAD FREE AND ROHS COMPLIANT
 MANUFACTURING REPORT REQUIRED
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We have Lead testing equipement and will not accept any assembly that 
contains lead. 
Please send an email confirming that you have read and accept the 
stated in this document before manufacturing.
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CONTACT DATA
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Company:    	_____________
Contact person: _____________
Contact phone:  _____________
Contact email:  _____________ (OPERATIONS/MANUFACTURING)  
		_____________ (ENGINEERING)


COMPONENTS MOUNTED / NOT MOUNTED
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Components that are NOT mounted are NOT included in the BOM or contain the note DNI (Do Not Include).
Non-mounted components do not appear in AssemblyDrawing2D.
Components noted with IS GENERIC = 1 could be changed to alternatives.


BOARD INFO
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See Readme_PCB


PANEL INFO
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Panel size:  1 x 4 boards 160 mm x 202 mm
Separation:  Milled (2.4 mm width) + 6x breakaway tabs
Panel info:  Mechanical Layer 16, see attached drawing "Panel.pdf"


SOLDER PASTE STENCIL  (TO BE DECIDED BY PCA ASSEMBLER)
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Laser cut stencil needed.
Thickness: 100 m to 150 m 


PASTE  (TO BE DECIDED BY PCA ASSEMBLER)
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Use PBFree and ROHS compliant paste. 
Powder size 3 (J-STD-006) recommended.


REFLOW PROFILE (TO BE DECIDED BY PCA ASSEMBLER)
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VACUUM SOLDERING IS PREFERRED.
Temperature profile.


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 MANUFACTURING REPORT REQUIRED
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A manufacturing report must be provided after manufacturing with the folowing info:
- Oven detailed temperature profile.
- Paste used (reference and manufacturer).
- Solder paste stencil thickness.