REFERENCE
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Project name:   i058D-H1 "Single Axis Interface Board for Denali NET"
Board name: 	i058D-H1-1.0 "Denali NET single axis interface board"


CONTACT DATA
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Company:    	Your company
Contact person: Your name
Contact phone:  Your phone
Contact email:  operations@email (OPERATIONS)  
		engineer@email (ENGINEERING)


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 I M P O R T A N T:
 THIS BOARD ASSEMBLY MUST BE LEAD FREE AND ROHS COMPLIANT
 MANUFACTURING REPORT REQUIRED
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BOARD INFO
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Material:   FR4 (Tg >= 150 ºC)
Thickness:  1.0 mm ± 0.2 mm

Board size: 49.8 mm x 23.2 mm (see board outline in Mechanical 2)
Layers:     10 layers (1 + 1 + 1 + 4 + 1 + 1 + 1)
Stack:	    See board stackup in "PCB_i058D-H1-1.0.PDF" file. 
            CHANGES IN THE STACK ARE NOT ALLOWED WITHOUT NOTIFICATION.
Copper thickness:
            - TOP, MID1, MID2, MID3, MID6, MID7, MID8, BOTTOM: Final thickness 35 µm
            - MID4, MID5: 35 um copper
Finish:     Electroless Nickel Immersion Gold (ENIG)
Solder mask:    2x Green (Top and Bot)
Silk screen:    TOP anb BOT
UL compliance: The board must meet UL 94 V0 and must have UL Marking.
Special instructions:
    - epoxy filled micro-vias on top and bottom
    - µvias from TOP to MID 1
    - µvias from MID 1 to MID 2
    - µvias from MID 2 to MID 3
    - Buried vias from MID 3 to MID 6
    - µvias from MID 6 to MID 7
    - µvias from MID 7 to MID 8
    - µvias from MID 8 to BOT
    - No stacked µvias


IMPORTANT: THIS BOARD MUST BE LEAD-FREE AND ROHS COMPLIANT


TECHNOLOGY & CLASS 
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Smallest drill = 600 µm
Smalled buried drill = 200 µm
Min track width external layers= 100 µm
Min track width internal layers= 100 µm
Min track spacing external layers= 125 µm
Min track spacing internal layers= 100 µm
Min via pad (external layers) = 450 µm


MICROVIAS
Diameter = 300 µm
Laser hole diameter = 100 µm
Microvias on external layers (TOP, BOT) must be epoxy filled. 


SOLDERMASK INFO
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ANY CHANGE ON THE SOLDERMASK MUST BE NOTIFIED
Standard mask expansion on pads  = 60 um
Standard minimum mask width  = 80 um
Components with special soldermask: (special mask expansion = 50 um, special minimum mask width = 75 um)
Components: D29 (see document "PCB_i058D-H1-1.0.PDF")


PANEL INFO
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Panel size:  4x3 boards(12) 183.8 mm x 147 mm    
Separation:  Milled 2.4 mm width + Breakaway tabs
Panel info:  Mechanical Layer 16, see attached drawing "Panel_i058D-H1-1.0.PDF"


GERBER INFO
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GTO: Top Overlay
GTP: Top Paste
GTS: Top Solder
GTL: Top Layer
G1:  Mid-Layer 1
G2:  Mid-Layer 2
G3:  Mid-Layer 3
G4:  Mid-Layer 4
G5:  Mid-Layer 5
G6:  Mid-Layer 6
G7:  Mid-Layer 7
G8:  Mid-Layer 8
GBL: Bottom Layer
GBS: Bottom Solder
GBP: Bottom Paste
GBO: Bottom Overlay
GM2: Mechanical Layer 2 (board outline)
GM16: Mechanical Layer 16 (panel dimensions)
