REFERENCE
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Project name:   i058D-H1 "Single Axis Interface Board for Denali NET"
Board name: 	i058D-H1-1.0 "Denali NET single axis interface board"


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 I M P O R T A N T:
 THIS BOARD ASSEMBLY MUST BE LEAD FREE AND ROHS COMPLIANT
 MANUFACTURING REPORT REQUIRED
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We have Lead testing equipement and will not accept any assembly that 
contains lead. 
Please send an email confirming that you have read and accept the 
stated in this document before manufacturing.

A manufacturing report must be provided to Ingenia after manufacturing with the folowing info:
- Oven detailed temperature profile.
- Paste used (reference and manufacturer).
- Cleaning agents used. 
- Solder paste stencil thickness.
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CONTACT DATA
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Company:    	Your company
Contact person: Your name
Contact phone:  Your phone
Contact email:  operations@email (OPERATIONS)  
		engineer@email (ENGINEERING)


COMPONENTS MOUNTED / NOT MOUNTED
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The design has only 1 assembly variant (BASIC).
Components that are NOT mounted are NOT included in the BOM or contain the note DNI (Do Not Include).
Non-mounted components do not appear in AssemblyDrawing2D.
Components noted with IS GENERIC = 1 could be changed to alternatives.


BOARD INFO
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See Readme_PCB


PANEL INFO
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Panel size:  4x3 boards(12) a
Separation:  Milled 2.4 mm width + Breakaway tabs
Panel info:  Mechanical Layer 16, see attached drawing "Panel_i058D-H1-1.0.PDF"


SOLDER PASTE STENCIL  (TO BE DECIDED BY PCA ASSEMBLER)
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Laser cut stencil needed.
Thickness: 100 µm to 150 µm 


PASTE  (TO BE DECIDED BY PCA ASSEMBLER)
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Use PBFree and ROHS compliant paste. 
Powder size 3 (J-STD-006) recommended.


REFLOW PROFILE (TO BE DECIDED BY PCA ASSEMBLER)
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VACUUM SOLDERING IS PREFERRED.
Temperature profile.
